This study examines the evolution of bonding wires utilized in semiconductor electronics over the past 25 years, with a particular emphasis on gold (Au), copper (Cu), and the emerging utilization of silver (Ag) wires. Bonding wires are of paramount importance for the interconnection of semiconductor chips with other components in electronic devices, such as mobile phones and computers.

This research project is concerned with the subject of thermosonic ball bonding, a process which is employed in the field of microelectronics for the purpose of connecting components of a relatively small scale. The objective of the study is to enhance comprehension of the manner in which materials behave during this process. Thermosonic bonding is a process that employs the combination of heat, ultrasonic vibrations, and pressure to create connections between a wire, typically gold or copper, and a substrate, such as aluminum.

The study examines the formation of bonds and the microscopic alterations in the materials utilized.

The objective of this study is to enhance the reliability assessment of wire bonds in power electronics, with a particular emphasis on the Highly Accelerated Lifetime Testing (HALT) methodology. In the context of electronic devices, wire bonding refers to a technique whereby thin wires are used to connect semiconductor components. With the passage of time, these bonds may succumb to failure as a consequence of wear and tear, particularly in the context of extreme temperature fluctuations. The researchers developed a mechanical testing method to simulate the failure that would naturally occur in wire bonds over time, thereby enabling them to predict the longevity of the bonds in real-world conditions.

The authors examine the advancements in wire bonding standards for the European automotive and power electronics industries. Wire bonding is a method of creating electrical connections between semiconductor devices and their packaging using thin wires, which are of critical importance for the production of microelectronics, such as batteries. The study concentrates on the DVS-2811 standard, which provides guidance on the testing and inspection of wire bonds.

This research project examines the reliability of various types of aluminum heavy wire bonds utilized in power electronics, with a particular focus on their performance in MOSFET modules. Wire bonding is a common method used to connect electronic components, but the reliability of these bonds is of critical importance for long-term performance. The study examines the impact of varying aluminum wire materials and diameters on the durability of these wire bonds during power cycling, a process whereby the system is repeatedly turned on and off, resulting in temperature fluctuations.

This paper presents a summary of the advancements in power electronic packaging, with a particular emphasis on the enhancement of reliability and performance under high temperatures. Power electronics are utilized in a multitude of devices to regulate electrical energy, and these systems encounter challenges due to the thermal stresses that are generated during operation. One area of focus is wire bonding, which involves the use of a metal wire to establish a connection between a semiconductor chip and other components.

The study focuses on wire bonding, a critical process for connecting electronic components within power modules. Wire bonding creates connections between a semiconductor chip and its supporting structure (substrate). In this research, scientists are examining how different angles at which the wire touches the chip, known as the bond foot angle, affect the longevity of these bonds. A larger bond foot angle tends to reduce the life of the wire bond because it introduces additional stress during operation. The team used both experiments and simulations to test the effects of varying bond foot angles on wire bond reliability.

The literature review examines advancements in copper (Cu) ball-wedge bonding, a technique utilized to establish connections between wires in electronic devices. Historically, gold (Au) was the material of choice due to its resistance to corrosion. However, the increasing costs associated with gold have prompted the exploration of alternative materials, such as copper. Copper offers superior electrical performance, but it also presents challenges such as oxidation (rusting) and increased hardness, which complicate the bonding process.